Neocon
Concept
Improves yield (defects) by removing the process gases (or fumes) remaining on wafer surfaces exposed to the atmosphere and the moisture (-OH) that is highly likely to react with them.
Without any additional supply of nitrogen (N2) or CDA, it creates an environment similar to an N2 EFEM through only a partial modification of the existing EFEM,
reducing investment costs and improving equipment utilization.
Spec
| Category | Specification |
|---|---|
| Item | Based on 100㎜ below the HAPA Filter / airflow velocity maintained at 0.4m/sec |
| Noise | Operating noise 77㏈ or less |
| Particle | Air bone Particle Static Condition : 1pcs/min(>@100 ㎚) , Class 1 |
| Vibration | 2.5㎛(P-P), at 3~100㎐ |
| Humidity | Internal EFEM humidity – 9% or less |
| Temperature | Internal EFEM temperature – 35℃ |
| Installation Time | Actual setup time, excluding carry-in |
Point
- Positive pressure (down flow) formed via FFU using clean-room air (constant temperature and humidity) * Internal EFEM humidity = clean-room humidity level (RH 40~50%)
- Reduces humidity inside the FOUP (cassette) using N2 gas * Internal EFEM humidity maintained at 40% / wafer-area humidity approx. 20%
- Maintains positive pressure inside the EFEM using N2 gas * Internal EFEM humidity managed to RH 1%▼
- Retains the existing EFEM air-conditioning system (FFU) with a dehumidification module installed * Internal EFEM humidity RH9% ▼